Electronic Materials

Using standardized tests like IPC, ASTM, ISO, and other methods, thermal analysis tests a large number of materials used in the electronics industry, such as silicon wafers, printed circuit boards, photo-resists, and packing, to name a few. In addition, thermal analysis also tests the packaging material in which electronic products are shipped  (see polymers).

Common tests include:

• Glass transitions by DSC, TMA or DMA

• Curing studies

• Photo-resists and photo-cured adhesives studies

• Modulus and damping properties by DMA

• Thermal Expansion in X, Y, or Z axis (size stability) by TMA

• Delamination by TMA

• Solvent exposure testing in DMA

• Quality control on plastic coverings and coatings

• Confirmation of Polymer type and grade by FTIR and DSC

• Melting point on solders, alloys, and other materials

• Curie point transitions in metals

• Outgassing and thermal stability

• Filler content

Melting of a Low Temperature Solder by STA